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Single layer pcb manufacturing process:Double Sided Soldermask With Plating Copper Word

Single layer pcb manufacturing process:Double Sided Soldermask With Plating Copper Word
Single layer pcb manufacturing process:Double Sided Soldermask With Plating Copper WordSingle layer pcb manufacturing process:Double Sided Soldermask With Plating Copper WordSingle layer pcb manufacturing process:Double Sided Soldermask With Plating Copper WordSingle layer pcb manufacturing process:Double Sided Soldermask With Plating Copper Word
group name
Single Sided PCB Manufacturing
Min Order
1 piece
brand name
PCBQuick PCB Manufacturing and Assembly
model
KF-01
Nearest port for product export
SZ
Delivery clauses under the trade mode
FOB, EXW, DDU, Express Delivery
Acceptable payment methods
T/T, PayPal, Westem Union, Cash, Escrow
Export mode
Export through agents
update time
Thu, 21 Nov 2024 14:30:00 GMT

Paramtents

  • Material FR4

  • Board Thickness 1.6mm

  • Copper Thickness 35um

  • Soldermask Color Black

  • Silkscreen Color White

  • Surface Technics ENIG

  • Min Holes 0.2mm

  • Min Line Width and space 5mil/5mil

Packging & Delivery

  • Min Order1 piece

Briefing

Printed Wiring Board:Single sided pcb,Plating Copper Word made with FR4 base have rigid laminate of woven glass epoxy material

Detailed

Single layer pcb manufacturing process:
On a typical PCB, the characters we see are usually painted in plain paint. However, some special circuit boards use copper as raw material for character marking.

A function of printing characters in copper is simply to look good. Use as nonferrous metal in product labeling can indirectly improve product image and brand value.

Another function of copper screen printing is to open the window in the stratum. As the foundation of electronic products, it links each component and keeps the current unobstructed. However, it is inevitable to generate heating in the working engineering. If the excessive heat cannot be spread out, it will not only hinder the current seriously, but also burn the circuit and cause damage. So the designers came up with an ingenious way of making the copper layer directly exposed to the air, which would allow it to dissipate heat more efficiently. So the designers combined the silk-layer characters on the surface of the printing plate to create a new process that combines thermal and expressive features - ground windowing.This technique is particularly common in high-power electronics。

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