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high density interconnect pcb 6Layer Blind Buried Via HDI PCB

high density interconnect pcb 6Layer Blind Buried Via HDI PCB
high density interconnect pcb 6Layer Blind Buried Via HDI PCBhigh density interconnect pcb 6Layer Blind Buried Via HDI PCBhigh density interconnect pcb 6Layer Blind Buried Via HDI PCBhigh density interconnect pcb 6Layer Blind Buried Via HDI PCB
group name
Special PCB Manufacturing
Min Order
1 piece
brand name
PCBQuick PCB Manufacturing and Assembly
model
KF-HDI PCB-03
Nearest port for product export
SZ
Delivery clauses under the trade mode
FOB, EXW, DDU, Express Delivery
Acceptable payment methods
T/T, PayPal, Westem Union, Cash, Escrow
Export mode
Export through agents
update time
Thu, 21 Nov 2024 19:39:51 GMT

Paramtents

  • Material FR4

  • Board Thickness 0.53+/-0.1mm

  • Copper Thickness Inner layer 17um,External layer

  • Soldermask Color Green

  • Silkscreen Color White

  • Surface Technics ENIG

Packging & Delivery

  • Min Order1 piece

Briefing

HDI with quick turn service
HDI PCB with high-quality at factory price

Detailed

high density interconnect pcb 6Layer Blind Buried Via HDI PCB

Product Description


Board Thickness: 0.53+/-0.1mm

Soldermask Color: Green

Surface Technics: ENIG(Au min 1.2uinch,Ni min 100uinch)

Min Line width and space:3mil/3mil

<p vertical-align:baseline;line-height:1.2;color:#555555;white-space:normal;background-color:#ffffff;"="" style="word-wrap: break-word; margin: 0px; font-family: "sans serif", tahoma, verdana, helvetica; box-sizing: border-box; padding: 0px; border-width: 0px; border-style: initial; border-color: initial; font-size: 14px;">BGA 0.5mm

Drill layer stack up: L1-L2,L2-L3,L3-L4,L4-L5,L5-L6,L1-L6


HDI PCB Manufacturing Process


HDI PCB Stack Up