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Paramtents
Material FR4
Board Thickness 0.53+/-0.1mm
Copper Thickness Inner layer 17um,External layer
Soldermask Color Green
Silkscreen Color White
Surface Technics ENIG
Packging & Delivery
Min Order1 piece
Briefing
Detailed
Product Description
Board Thickness: 0.53+/-0.1mm
Soldermask Color: Green
Surface Technics: ENIG(Au min 1.2uinch,Ni min 100uinch)
Min Line width and space:3mil/3mil
<p vertical-align:baseline;line-height:1.2;color:#555555;white-space:normal;background-color:#ffffff;"="" style="word-wrap: break-word; margin: 0px; font-family: "sans serif", tahoma, verdana, helvetica; box-sizing: border-box; padding: 0px; border-width: 0px; border-style: initial; border-color: initial; font-size: 14px;">BGA 0.5mmDrill layer stack up: L1-L2,L2-L3,L3-L4,L4-L5,L5-L6,L1-L6
HDI PCB Manufacturing Process
HDI PCB Stack Up
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