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Paramtents
Material FR4
Board Thickness 1.6mm
Copper Thickness 50um
Soldermask Color Green
Silkscreen Color White
Surface Technics ENIG
Min Holes 0.2mm
Min Line Width and space 5mil/5mil
Packging & Delivery
Min Order1 piece
Briefing
Detailed
Product Description
Material: FR4
Board Thickness: 1.6mm
Copper Thickness: 50um
Soldermask Color: Green
Silkscreen Color: White
Surface Technics: ENIG
Min Holes:0.2mm
Min Line Width and space:5mil/5mil
FR4 Made Ability
NO | Item | Craft Ability |
---|---|---|
1 | Surface Finishh | HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc |
2 | Layer | 2-30 layers |
3 | Min. Line Width | 3 mil |
4 | Min. Line Space | 3 mil |
5 | Min. Space between Pad to Pad | 3 mil |
6 | Min.Hole Diameter | 0.10 mm |
7 | Min. Bonding Pad Diameter | 10 mil |
8 | Max. Proportion of Drilling Hole and Board Thickness | 1:12:5 |
9 | Max. Size of Finish Board | 23 inch*35 inch |
10 | Rang of Finish Board's Thickness | 0.21-7.0 mm |
11 | Min. Thickness of Soldermask | 10 um |
12 | Soldermask | Green,Yellow,Black,White,Red,Transparent photosensitive solder mask,Strippable solder mask |
13 | Min. Linewidth of Idents | 4 mil |
14 | Min. Height of Idents | 25 mil |
15 | Color of Silk-screen | White,Yellow,Black |
16 | Date File Format | Gerber file and Drilling file,Report series,PADS 2000 series,Powerpcb series,ODB++ |
17 | E-testing | 100% E-Testing:High Voltage Testing |
18 | Material for PCB | High TG Material:High Frequence (ROGERS,TEFLON,TADONIC,ARLON):Halogen-free Material |
19 | Other Test | Impedance Testing,Resistance Testing,Microsection etc |
20 | Special Technological Requirement | Blind&Buried Vias and High Thickness Copper |
PCB Certificates
UL, TS16949, ISO14001, ISO9001-2008, and RoHS
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