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Paramtents
Number Of Layer 4Layer
Base Material FR4
Copper Thickness 35um
Board Thickness 1.6mm
Soldermask Color Red
Silkscreen Color White
Surface Technics ENIG
Min Holes 0.2mm
Min Line 4mil
Min Space 4mil
Packging & Delivery
Min Order5 piece
Briefing
Detailed
FR4 0.4mm 4layer PCB multilayer circuit board With Mirror makeup
Parameter
Material: FR4
Board Thickness: 0.4mm
Copper Thickness: 35um
Soldermask Color: Red
Silkscreen Color: White
Surface Technics: ENIG
Min Holes:0.2mm
Min Line space and width: 4/4mil
Technology
4layer board:1.6mm
32pcs in one panel without "X",Mirror makeup(On one panel have TOP and BOT layer)
Routing + Stamp hole
Vias cover soldermask
Fiducial MARK Point: 1.0mm
PCB Technology edge width 5mm
4layer Multi-layer circuit board 0.4mm Lamination:
Inner Layer Core thickness:0.15MM
Finished board thickness:1.6mm±0.1MM
_____________________ H (Copper)
_______________ 1080*1(2.8mil*1) (PP)
0.15MM(core+copper)
_______________ 1080*1(2.8mil*1) (PP)
_____________________ H (Copper)
0.3mm+/-0.075mm
Certificate
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