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Design for fast 94v-0 led pcb prototype board motherboard

Design for fast 94v-0 led pcb prototype board motherboard
Design for fast 94v-0 led pcb prototype board motherboardDesign for fast 94v-0 led pcb prototype board motherboardDesign for fast 94v-0 led pcb prototype board motherboardDesign for fast 94v-0 led pcb prototype board motherboardDesign for fast 94v-0 led pcb prototype board motherboard
group name
Multilayer PCB Manufacturing
Min Order
1 piece
brand name
PCBQuick PCB Manufacturing and Assembly
model
KF-FR4 PCB-08
Nearest port for product export
SZ
Delivery clauses under the trade mode
FOB, EXW, DDU, Express Delivery
Acceptable payment methods
T/T, PayPal, Westem Union, Cash, Escrow
Export mode
Export through agents
update time
Thu, 21 Nov 2024 23:37:07 GMT

Paramtents

  • Base Material: FR4

  • Copper Thickness 1oz

  • Board Thickness 1.6mm

  • Min. Hole Size 0.2mm

  • Min. Line Width 0.2mm

  • solder mask white

  • silk screen black

Packging & Delivery

  • Min Order1 piece

Briefing

Design for fast 94v-0 led pcb prototype board motherboard

Detailed

Specifications
NOItemCraft Ability
1Surface FinishHASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc
2Layer1-30 layers
3Min.Line Width3mil
4Min.Line Space3mil
5Min.Space between Pad to Pad3mil
6Min.Hole Diameter0.10mm
7Min.Bonding Pad Diameter10mil
8Max.Proportion of Drilling Hole and Board Thickness1:12:05
9Max.Size of Finish Board23inch*35inch
10Rang of Finish Board′s Thickness0.21-7.0mm
11Min.Thickness of Soldermask10um
12SoldermaskGreen,Yellow,Black,White,Red,transparent photosensitive solder mask,Strippable solder mask
13Min.Linewidth of Idents4mil
14Min.Height of Idents25mil
15Color of Silk-screenWhite,Yellow,Black
16Date File FormatGerber file and Drilling file,Report series,PADS 2000 series,powerpcb series,ODB++
17E-testing100%E-Test:High Voltage Testing
18Material for PCBHigh TG Material:High Frequence(ROGERS,TEFLON,TADONIC,ARLON):Haloger free Material
19Other TestImpedance Testing,Resisitance Testing,Microsection etc
20Special Technological RequirementBlind&Buried Vias and High Thickness Copper
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