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Paramtents
Material Aluminium
Board Thickness 1.0-2.0mm
Copper Thickness 25um
Soldermask Color White
Silkscreen Color Black
Surface Technics OSP or HAL-Free
Packging & Delivery
Min Order1 piece
Briefing
Detailed
Aluminum PCB Flow Chart | |||||||||||
Material Purchasing | → | IQC | → | Cutting | → | CNC Drilling | → | IPQC | → | Image Transfer pertreatment | |
↓ | |||||||||||
IPQC | ← | Etching | ← | IPQC | ← | Developing | ← | Exposure | ← | IPQC | |
↓ | |||||||||||
Solder Mask Dretreatment | → | IPQC | → | Solder Mask Printing | → | Solder Mask Baking | → | Solder Mask Exposure | → | Solder Mask Develop | |
↓ | |||||||||||
IPQC | ← | Surface Treatment | ← | Legend Curing | ← | IPQC | ← | Legend Printing | ← | IPQC | |
↓ | |||||||||||
Routing | → | V-cut | → | Clear | → | ET-TEST | → | Final | → | Packing | |
8 IPQC(InPut Process Quality Control),guarantee product quality 、safty and reliety | |||||||||||
Copper thickness |
0.5oz, 1oz, 2oz, 3oz |
|
Dielectric Thickness(to Substrate) |
0.05mm, 0.075mm, 0.1mm, 0.15mm, 0.2mm |
|
Substrate Core Thickness |
0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm |
|
Min. Track Width/gap | 0.2mm (8mils) | |
Surface Finishing | HASL, HASLLeadfree, Immersion gold, OSP | |
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