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Paramtents
Base Material FR4,Aluminum,Copper Core ,etc
Board Thickness: 0.4-3.2mm
Copper Thickness: 1oz-3oz
Surface Finishing: OSP,HASL.Immersion Gold etc
Certificate: ISO14001,,RHOS
Packging & Delivery
Min Order1 piece
Briefing
Detailed
1 Base Material :FR4,Aluminum,Copper Core,CEM-3,CEM-1,PTFE,BT,Rogers ,High TG,,Lead Free,Halogen Free
2 Layer :1~8
3 Board Thickness :0.4~3.2mm
4 Board Thickness Tolerance: ±10%
5 Finished Outer Copper Thickness:1~2oz(35~70μm)
6 Finished Inner Copper Thickness: 0.5~1oz(17~35μm)
7 Min Board Size:5*5mm
8 Max Board Size:550*560mm
9 Min Line Width/Space: 3/3mil
10 Min Hole Size :0.2mm
11 Hole Tolerance: ±0.07mm/±0.05mm
12 Solder Mask: Green,Red, Blue,White,Black,Yellow,etc.
13 Surface Finish: HASL, HASL lead free,OSP, Immersion gold/Tin/ Silver,Hard gold, Flash gold,etc.
14 Flammability: 94V-0
15 Min S/M Bridge: 4mil
16 Character Width: ≥0.1mm
17 Character Height: ≥0.08mm
18 Certificate: ISO UL ROHS
19 Value-added : Service Design,Clone,Assembly,Manufacture
20 Application: Consumer electronic,Industrial control,Green energy, Air conditioner,Washing machine,electronic equipment,etc.
21 Packing: Vacuum package
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