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Paramtents
Base Material FR-4/aluminum
Copper Thickness 0.25 oz -4 oz
Surface Finishing Immersion Gold,HASL,OSP
Soldermask Green, Red, Brown, White
Number of Layers Single, Double, Multilayers
Product name electronic pcb assembly
Certificate RoHS, UL,SGS, ISO/TS16949, ISO9001
Board Thickness 0.2mm--3.2mm
Packging & Delivery
Min Order1 piece
Briefing
Detailed
Stencil Size | 736x736mm |
Minimum IC Pitch | 0.2mm |
Maximum PCB size | 1200x 500mm |
Minimum PCB thickness | 0.25mm |
Minimum chip size: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
Maximum BGA size: | 74x74mm |
BGA ball pitch: | 1.00mm (minimum), 3.00mm (maximum) |
BGA ball diameter: | 0.40mm (minimum), 1.00mm (maximum) |
QFP lead pitch: | 0.38mm (minimum), 2.54mm (maximum) |
Volume: | One piece to low volume production quantities Low cost first article builds Schedule deliveries |
Assembly type: | Surface mount(SMT) assembly DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement Cable assembly |
Components type: | Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch |
Parts procurements: | Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest |
Solder type: | Leaded Lead-free/ROHS compliant |
Other capabilities: | Repair/rework services Mechanical assembly Box build Mold and plastic injection. |
OEM/ODM/EMS Services for PCBA:
Capability - SMT
Capability - PTH
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